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Website Snapshot of FIRST LEVEL INC

FIRST LEVEL INC

(717) 266-2450

3109 Espresso Way, York, Pennsylvania   17406 , USA

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General Info:

Microelectronic PackagingPrecision Component PlacementDie AttachWire Bond-wedge and ballCircuit Board Design and AssemblyStud BumpingEncapsulationHermetic Lid SealingLead AttachPackage Design and Assembly

Products & Services:

  • Electronic
  • Manufacturing
  • Services
  • Subcontract
  • Semiconductor
  • Packaging
  • Manufacturer
  • Optoelectronic
  • Medical
  • Assembly
  • Cob
  • Chipscale
  • Packages
  • Modules
  • Wirebond.diebond
  • Circuitboard
  • Pcb
  • Component
  • Encapsulation
  • Multichip
  • Hybrid
  • Leadattach
  • Studbumping
  • Micropost

Company Profile:

Contact: 717-266-2450
Address: 3109 Espresso Way
York, Pennsylvania   17406 , USA
Url: http://www.firstlevelinc.com
Fax: 717-266-7410
   
Year Established: 2000
Annual Sales: Below US$1 Million
Market Sectors: Commercial,Governmental
Business Type: Manufacturer
Ownership: Woman owned
Sales/Service Area: National

Contract References:

  • -
  • - ITT
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