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Website Snapshot of Royce Instruments, Inc.

ROYCE INSTRUMENTS, INC.

(707) 255-9078

500 Gateway Dr., Napa, California   94558 , USA

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Products & Services:

  • Die Handling
  • Bond Testing
  • Laser Diode Processing
  • Assembly Tools
  • Wire Bond Testing Machines
  • Photonics
  • Laser Diode Manufacturing
  • Wire Bond Testing
  • Die Bond Testing
  • Semiconductor Pick And Place
  • Pick And Place Into Trays
  • Pick And Place Into Tape And Reel
  • Laser And Photonics Manufacturers

Web Site Results

Print |Print| AutoPlacer MP300 Automatic Die Handling & Sorting System Highly Flexible, Low Cost Fully automated pick and place. Designed for automatic die sorting from wafer maps... sorters have uniquely solved many die handling problems in Laser Diodes, MEMS, Microfluidics, Ink Jet head, Lab on Chip (LOC) and BioChip manufacturing. Let our experienced..., including Multi Project wafers (pizza masks) Easy to set up with DieSort Manager software and expanded wafer map library Fast change to new die size and output medium with pre...
InstrumentsPublicationsCareer OpportunitiesShow ScheduleFind a RepresentativeBuy Consumables |Print| AutoPlacer MP300 Automatic Die Handling & Sorting System Highly Flexible, Low Cost Fully automated... library Fast change to new die size and output medium with pre-leveled output fixtures Flexible platform handling 3 inch to 300mm wafers on many hoop and frame types Picks... inversion of bumped die into output trays a simple process. Royce die sorters have uniquely solved many die handling problems in Laser Diodes, MEMS, Microfluidics, Ink Jet head, Lab...
Print |Print| System DE35-ST Semi-Automatic Die Handling System Available for up to 300mm dia wafers. 700 to 1200 UPH, application dependent. Quick change multi-needle eject heads.... Output stage for waffle packs, Gel-paks, film frames etc. Options Include: Non Surface Contact die picking. Die Inverter. Die underside inspection. Laser Diode high mag facet...
InstrumentsPublicationsCareer OpportunitiesShow ScheduleFind a RepresentativeBuy Consumables |Print| System DE35-ST Semi-Automatic Die Handling System Available for up to 300mm dia wafers. 700 to 1200...DE35-ST Semi-Auto Die Sorter HomeSitemapContact Home Die Sorters System DE35-ST HomeBond TestersDie SortersAutoPlacer MP300System DE35-STSupportAbout Royce... UPH, application dependent. Quick change multi-needle eject heads. Output stage for waffle packs, Gel-paks, film frames etc. Options Include: Non Surface Contact die picking. Die...
650 Universal Bond tester, Wire Pull Tester, Ball Shear Tester, Die Bond SHear Tester, Solder Ball Pull Tester, Zone Shear Tester
ScheduleFind a RepresentativeBuy Consumables Royce Instruments , excellence in Bond Testers and Die Sorters Bond Testing Royce Instruments bond testers handle a wide variety...Royce Instruments, Excellence in Bond Testers and Die Sorters HomeSitemapContact Home HomeBond TestersDie SortersSupportAbout Royce InstrumentsPublicationsCareer OpportunitiesShow... of chip and wire testing applications. Comprehensive SPC and data export capabilities Capabilities include: Wire bond pull test Ball bond shear test Solder ball shear test Die bond...

Company Profile:

Contact: 707-255-9078
Address: 500 Gateway Dr.
Napa, California   94558 , USA
Url: http://www.royceinstruments.com
Fax: 707-255-9079
   
Year Established: 1985
Annual Sales: Below US$1 Million
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