3140 Northwoods Parkway Suite #300a
Norcross, Georgia   30071 , USA


Engent is a provider of next generation electronic manufacturing, packaging & technology services. We help our clients realize products that require small form factors, as well as high performance packaging for electronics systems which incorporate technologies including System in Package, Flip Chip, MEMS, Die stacking, and 0201 placement to name a few. Engent brings breadth and depth of knowledge about electronics process development and production to both your design team and manufacturing support groups. Working with Engent can shorten your time to market and enable your products to be manufactured at high volumes.

Products & Services

  • Electronics Manufacturing
  • System In Package Assembly
Year Established 2002
Annual Sales US$2.5 Million - US$5 Million
Market Sectors Industrial,Commercial,Governmental
Business Type Manufacturer
Sales/Service Area International

Web Site Results

Electronic Manufacturing Services (EMS) Engent
...of next generation electronic manufacturing and technology services.
System in Package Small Form Factor Micro-Electronics Assembly
...with specialization in Electronics Packaging, ...Electronics Packaging, Electronics Manufacturing MEMS/MOEMS Packaging,
...enables the ongoing manufacturing expansion of its ...form factor micro-electronics products. "The facility ...develop solutions in electronic assembly technologies, including
ENGENT AAT :: Enabling Next Generation Technologies
...approved for the manufacturing of electronic and micro-
ENGENT AAT :: Enabling Next Generation Technologies
...advanced, leading edge electronics and microelectronics packaging ...microelectronics development and manufacturing services. Located in ...stages of the electronic miniaturization process and