General Info:
first level inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. the company has class 10,000 esd protected cleanrooms for die attach, wire bonding, and component assembly. expert engineers and highly skilled technicians provide design, process, and manufacturing services.
Products & Services:
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Web Site Results
the tools needed to properly design and build any packaging project. Whether your project is an optoelectronic application, an electronic medical device, a MEMS or a device... Assembly, Prototype build and Process development. Our services: Prototyping Production Process Development Optoelectronics Technology Optoelectronics Technology Design Assembly... / ROSA Assembly XFP & Transponder Assembly Package Design Substrate Design Design Validation Lead Frame Design Consulting Consulting Emphasizing Quality Performance Cost Reduction...
Company Profile:
| Contact: | 717-266-2450 |
| Address: |
York, Pennsylvania 17406 , USA |
| Url: | http://www.firstlevelinc.com |
| Fax: | 717-266-7410 |
| Year Established: | 2000 |
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