Chip product capabilities include: Flip Chip in package (FCIP) such as FCBGA and Flip Chip on board (FCOB) Organic laminates or ceramic substrates Single or multiple Flip Chip... attach Wire bond (Aluminum and Gold) Flip Chip Encapsulation and transfer mold Substrate solder ball attach Device Singulation Standard IC Packages Available Hermetic & Ceramic From..., transfer mold, open cavity, or CORWIL's proprietary temporary sealing method for easy access to die Substrate design and fabrication BGA Assembly Datasheet Flip Chip CORWIL's Flip...

Manufacturing (EMS) Leading EMS companies frequently subcontract to CORWIL for Chip-on-Board manufacturing or for other SIP or MCM production. 2007 CORWIL Technology Coorporation. All rights reserved. Site Map | Contact Us ... ranging from sophisticated imaging chips that sent back pictures from Mars on the Spirit and Opportunity Mars Rovers to low cost, high volume, commercial RF identification chips... and security equipment, CORWIL has played a significant role in helping launch many customers imaging chips into these markets. CORWIL's clean room disciplines meet the extreme cleanliness...