is on prototype development of all types of bumping requirements, initial production ramps, and specialty bumping of flip chip interconnect applications that require a high degree... Capabilities Our Mission To become a world-class leader in wafer bumping and flip chip interconnect technology by providing superior customer service and uncompromised quality. These...

Austin facility is on prototype development of all types of bumping requirements, initial production ramps, and specialty bumping of flip chip interconnect applications that require...