industry through our 3D integration technologies, and continually advance the way semiconductor products are designed and manufactured. Ziptronix technologies lower manufacturing.... Ziptronix Direct Bond Interconnect technology (DBI ) technology enables silicon to be architected and built in a 3D fashion to maximize the density of signal paths that chips use... by alleviating interconnect delays with the use of scalable 3D routing. Ziptronix technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level...

Technologies to Tezzaron Semiconductor December 12, 2012 Ziptronix Licenses its Direct Bond Technology for Mobile Handsets July 9, 2012 Ziptronix and Customer Pursue Lower-Cost 3D... November 2, 2011 Ziptronix Signs Licensing Agreement with Sony August 31, 2011 Ziptronix Sponsors Delta Sky Magazine NCTA Ad July 1, 2011 Ziptronix Video Release July 6, 2011 3D... and Aerospace Electronics 3D Integration is poised to drive the next generation of military imaging sensors February 2010 SOCcentral Staying on the Path to Moores Law Requires 3D...

Home Ziptronix SEARCH Home Company Technologies Applications News & Downloads Contact Us Ziptronix 3D IC Technology is Affordable, Scalable, and Patented Ziptronix, the leader... temperature wafer bonding process, ZiBond technology and Direct Bond Interconnect technology(DBI ) enable 3D architectures with the smallest footprint and the smallest volumetric size... with interconnect solution. Backed by the most advanced 3D technologies available, Ziptronix, Inc. is your partner today and the future. News & Announcements Ziptronix Licenses DBI and ZiBond...

links will open PDF files of white papers developed by Ziptronix engineers. 3D CMOS Imagers with Ziptronix DBI Technology 800 Perimeter Park Drive, Suite B, Morrisville, NC 27560 2013 Ziptronix, Inc. All Rights Reserved. ...

for displays and image projection, 3D SOCs, MEMS, and pressure transducers encapsulated at the wafer level. We use high-quality, industry standard tools in the engineering... of semiconductor manufacturing processes. Our clean room facility allows us to provide a full range of back-end-of-line 3D IC fabrication, wafer level packaging, and testing services aimed... technology transfer from design through production to deliver the highest quality 3D technology solutions. 800 Perimeter Park Drive, Suite B, Morrisville, NC 27560 2013 Ziptronix, Inc. All Rights Reserved. ...