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Website Snapshot of Semiconductor Equipment Corp.

SEMICONDUCTOR EQUIPMENT CORP.

(805) 529-2293

5154 Goldman Ave., Moorpark, California   93020 , USA

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General Info:

sec manufactures manual and semiautomatic assembly, rework, handling and test equipment used in development and production of microelectronic devices for the semiconductor, hybrid and printed circuit industries. equipment ranges from flip chip die bonders, die handling equipment, rework systems, test equipment, pick and place systems, wafer and die tape to mounting equipment.

Products & Services:

  • Semiconductor Equipment
  • Semiautomatic Assembly
  • Test
  • Microelectronic
  • Handling
  • Flip Chip Placement
  • Surface Mount Rework
  • Hi-rel
  • Ball Grid Array
  • Quad Flat Pack
  • Multichip Modules
  • Eutectic Die Bonder
  • Pick And Place
  • Electronic Components
  • Packaging
  • Backlap Tape Applicator
  • Wafer Fracturer
  • Bga
  • Smd
  • Wafer Dicing Tape
  • Blue Tape
  • Nitto Tape
  • Qfp
  • Flip Chip
  • Die Bonder
  • Epoxy Dispenser
  • Die Expander
  • Flip Chip Bonder
  • Assembly Equipment
  • Mcm
  • Chip Scale
  • 300 Mm
  • Silicon Wafer
  • Wafer Dicing Tape
  • Uv Tape
  • Temporary Adhesives
  • Water Soluble Adhesives
  • Multifunctional Bond Tester
  • Wire Pul
  • Bond Shear
  • Die Shear
  • Aquabond
  • Aquaclean

Web Site Results

Corporation Moorpark, CA Circuits Assembly, 2001 Read Article>> Flip Chip Attachment by Don Moore, President, Semiconductor Equipment Corporation Moorpark, CA N/A Read Article>> BGA Rework...Semiconductor Equipment Corporation - Published Articles "SEC has worked with many innovators in publishing the developments that have evolved in the microelectronics industry... Article Index Versatile Bonder is the Design Key to Attaching Laser Diodes by Don Moore, President, Semiconductor Equipment Corporation Moorpark, CA US Tech, July 2001 Read Article...
and semiautomatic assembly, rework, handling, and test equipment used in the development and production of microelectronic devices for the photonics, semiconductor, hybrid...Semiconductor Equipment Corporation - Semicorp.com "Thirty five years of innovation." Contact Us | About SEC | Sitemap Home Products Tape Standard Dicing High Purity UV Curvable... Bonding VCSELs Wafer Mounting Laser Diodes Gold Bumped Die Welcome! Semiconductor Equipment Corporation strives to be a leading designer and manufacturer of a wide range of manual...
Articles What's New Request Info Peeler Option Peeler for removing backgrinding tape once the wafer has been thinned. This option includes a roller assembly, vacuum chuck and tape...>> Home | Products | Representatives | Articles | About SEC | Request Info | What's New | Sitemap Semiconductor Equipment Corporation 5154 Goldman Ave. Moorpark, CA 93021 Phone...
MSA840-II Nitto Denko
Semiconductor Equipment Corporation - New Products Contact Us | About SEC | Sitemap Home Products Tape Standard Dicing High Purity UV Curvable Dicing Heat Release Ink Jet Cover... prevent particles from accumulating with regular use. Learn More>> FOUP Cleaner Semiconductor Equipment Corporation's SORA UPC-12500 Fully Automatic FOUP Cleaning System has... the highest throughput among single FOUP processing systems. Learn More>> MSA840-II Nitto Denko Product Video Semiconductor Equipment Corporation is the distributor for the new Nitto...

Website Links:

Company Profile:

Contact: 805-529-2293
Address: 5154 Goldman Ave.
Moorpark, California   93020 , USA
Url: http://www.semicorp.com
Fax: 805-529-2193
   
Year Established: 1975
Annual Sales: US$2.5 Million - US$5 Million
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