packaging VIA 1 Repassivation Minimum... Copper Bumping Layout Guidelines Copper Bumps (Solder, Nickel, Gold or Indium Cap) 1 Bump Height... Indium Bumping Layout Guidelines Indium...

Bumping needs. Client client Our Services Solder Bumping Gold Bumping Copper Bumping Indium Bumping Pad Redistribution Mask Layout Backgrinding Dicing Pick and Place Custom...

and Dependability? details Rely on TLMI! details ITAR and ISO 9000 Registered details Gold and Indium Bumping details Copper and Solder Bumping details Pad Redistribution (RDL) details... a high degree of engineering skill. TLMI can help with transferring your device to any high volume wafer bumping company. Our Services Solder Bumping Gold Bumping Copper Bumping..., redistribution and our unique copper bumping, as well as mask layout, backgrinding, dicing and pick & place services. Our advanced plating technology allows for fine pitch bumping...

avail) Copper/Nickel 3 um / 2 um Copper (experimental) 3 um Gold 3 um Minimum Overlap (Outside Via 1 Passivation) 7 um per side 8 m per side, 10 um preferred 8 m per side, 10 um...

Process Incoming / Pre Clean Sputter Resist Coating Align / Expose Plate Strip Etch, Reflow or Anneal Final Inspection Our Services Solder Bumping Gold Bumping Copper Bumping Indium...