stress die & component attach adhesive optimized for GaAs MMIC attach.HYSOL ECCOBOND 56C Adhesive designed to make electrical connections where hot soldering is impractical... film PV assembly with superior contact resistance stability. Low viscosity for fine line dispensing.HYSOL QMI529HT-LV Conductive die attach adhesive has been formulated for use... in high throughput die attach applications.LOCTITE 3880 Loctite 3880 is designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion...

cure, low stress die & component attach adhesive optimized for GaAs MMIC attach.HYSOL ECCOBOND CE3103WLV Electrically conductive adhesive for thin film PV assembly with superior...