international micro industries (imi) offers state of the art wafer bumping and wafer level packaging wlp contract services via high aspect ratio, high precision electroplating and photolithography technology. imi offers complete solutions; wafers from received from the fabricator, bumped by imi, then sent directly to our clients in the advanced chip packaging, medical, automotive, sensor, rfid and mems industries world-wide.

Wafer Bumping Wafer Bumping Contract Services Wafer Level Processing Wafer Level Packaging Contract Services Wlp Wafer Electroplating High Aspect Ratio Electroplating Electroplating Ubm Thick Photoresist Gold Bump Gold Bumping Au Bumping Solder Bumps Solder Bumping Tin Lead Bumps Pillar Bumps Copper Pillar Bumps Copper Electroplating Indium Bumps Indium Bumping Gold/tin Bumps

Au/sn Bumps Au/sn Bumping Known Good Packaging Known Good Die Advanced Chip Packaging Tape Automated Bonding Tab Flipchip Flip Chip Packaging Bare Die Packaging Fine Pitch Bumps Plated Vias Plated Bumps Bump Bumps Plating Imi International Micro Industries Inc. Cherry Hill New Jersey Nj