Die Attach Call our main office 480-736-0406 HomeAboutWho We AreWhat We DoOur FacilityNewsServicesBackgrindingDicingPackage AssemblyDie AttachWirebondingReliability TestingX-Ray... & Support ProcessPrototypingRF Assembly & TestProcessConceptDevelopmentSolutionIndustriesBusiness to BusinessDefenseEducation / UniversitiesHealth & MedicalContact Die Attach No Die... Attach Job is Too Small We have manual and automatic equipment to handle a wide variety of applications. Die types include: Standard silicon down to .003 thick Surface-sensitive...

) Gold wedge bonding Gold ribbon bonding Aluminum wedge bonding Up to 38um wire Special Applications: Au Stud bumping BSOB Die Stud bumping for flip chip Individual Reticles Partial... wafers Insulated Au wire great for close wire configurations or crossed wires Poor bondability material Stacked die Call 480-736-0406 or email us to discuss your project...

equipment or specialized equipment supplied by our customers. Wire Pull - up to 100g Die Shear - up to 100Kg Ball Shear - Flip Chip to BGA Ball Wire Bond Shear Temperature Cycle (-40...

to large, and ideal to seemingly impossible. Learn More X-Ray & Support Process Use our X-ray services to examine balling, die attachment and placement, wire bond attachments...

, die attachment and placement, wire bond attachments, and other electrical or mechanical components used in assembly construction. We can view items from any angle or perspective...