and break process where the breaking mechanism applies a force over a limited area of the wafer. Why use limited contact dicing? When materials are sensitive to contact pressure... LSD-100 and LSD-150 Dicing Machines offer breaking mechanisms that can effectively avoid sensitive areas of the wafer. Process: Limited contact dicing is achieved by making a scribe...Limited Contact Dicing Home Services Products About Us Contact Us Consulting Contract Services Scribing Breaking Full Contact Dicing Limited Contact Dicing Cleaving Services...

reliability. It can dice three to four 100 mm wafers per hour (assuming a nominal die size of 1x1 mm). The scribe line guides the break. It is a single crack across the wafer that causes... the wafer to break into strips, or the strip to break into dice. The LSD-110, like the LSD-100, uses beam bending to induce tensile strain lateral to the scribe line. 2001-06 Loomis...Break Bar Break Bar Technology The Loomis LSD-110 break mechanism is more subtle and faster than the LSD-100. It is very productive, yielding dice with industry-leading...

and break process where the breaking mechanism applies a force over a distributed area of the wafer. Why use full contact dicing? When materials are not sensitive to contact pressure...: Full contact dicing is achieved by making a scribe line along the separation channels of a wafer and then applying a bending force across the scribe line. The scribe line creates...Breaking Home Services Products About Us Contact Us Consulting Contract Services Scribing Breaking Full Contact Dicing Limited Contact Dicing Cleaving Services Breaking: Full...

. Die Separation With the Loomis Machine, the results of your scribing and dicing are instantly observable. After a scribe line is broken, holding film under the wafer pulls the newly... formed piece away from the body of the wafer and a gap forms. This is thanks to the tension of the wafer film. This tension causes the film to expand as the wafer is diced...Break Wheel Break Wheel Breaking a wafer is achieved by applying tensile strain lateral to the scribe line. The Loomis "break wheel" method is a hybrid of two standard methods...

of least resistance. The Loomis wafer handling technique avoids problems associated with dice collision and chipping. Unless the wafer holding film grows as dicing takes place, the dice...Cleaving Home Services Products About Us Contact Us Consulting Contract Services Scribing Breaking Full Contact Dicing Limited Contact Dicing Cleaving Services Breaking: Cleaving... cleave materials? Separation along natural planes creates the cleanest edge possible due to the regularity of the materials molecular structure. For semiconductor wafers, cleaved...