Handling Tools for the Electronics Industry SMIF POD AND FOUP DOOR OPENERS Standard Mechanical Inter Face (SMIF) pods and Front Opening Unified Pod (FOUP) carriers are based on an Isolation technology developed in the 1980s at Hewlett-Packard. Today, this system is in used in many semiconductor wafe...

Handling Tools for the Electronics Industry THIN SUBSTRATE VACUUM WAND HANDLING TOOLS H-SQUARE manufactures an extraordinary number of different types of vacuum tips for many different sizes, shapes, weights and materials of wafers, substrates, dies and packages and applications/equipment, as well a...

Handling Tools for the Electronics Industry 100mm VACUUM WAND HANDLING TOOLS H-SQUARE manufactures an extraordinary number of different types of vacuum tips for many different sizes, shapes, weights and materials of wafers, substrates, dies and packages and applications/equipment, as well as for a c...

Handling Tools for the Electronics Industry COMPOUND MATERIALS VACUUM WAND HANDLING TOOLS PART NUMBER DESCRIPTION MATERIAL NOASPF2 WAND HANDLE ESD Safe PVDF T794PKAS VACUUM TIP ESD Safe PEEK CC11SDS COIL CORD ESD Safe Polyurethane HSU HOLDER White Polypropylene T791PKAS 50mm-75mm ESD safe PEEK GaAs,...

Handling Tools for the Electronics Industry 125mm VACUUM WAND HANDLING TOOLS H-SQUARE manufactures an extraordinary number of different types of vacuum tips for many different sizes, shapes, weights and materials of wafers, substrates, dies and packages and applications/equipment, as well as for a c...