flipchip international offers world class die services to complement our world famous bumping services. die services include wafer level electrical test, backgrind, dicing, optical inspection and packaging into tape/reel,trays and film frames. fci enables full turn key processing for flip chip and wafer level packaging - from your wafer fab site to shipping directly to your customers.

Backgrind Thinning Sawing Dicing Inspection Optical Inspection Aoi Electrical Test Wafer Probe Wafer Map

Tape And Reel Tray Waffle Pack Film Frame Known Good Package Ship Direct Sow Rfq Quotation