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TIMTRONICS

, Yaphank, New York   11980 , USA

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General Info:

timtronics is a leading manufacturer of thermal interface materials, thermal management materials, thermal compounds, thermal pastes, heat sink compounds, silicone heat sink compounds, non silicone heat sink compounds, thermal grease, conductive greased, non silicon compounds, non silicone thermal grease, epoxy, heat sink grease, silicone interface materials, interfaces materials, thermal management solutions, grease compounds, thermally conductive compounds, thermally conductive grease, conductive compounds, conductive grease, electrically conductive compounds, electrically conductive grease, high temperature conductive grease, high temperature thermal grease, thermal joint compound, filler grease, filler compounds, gap filler, insulator grease, carbon grease, cpu grease, non curable compounds, silver grease, thermally conductive epoxy & electrically conductive epoxy. timtronics also specializes in oem cuteom formulations and private labeling.

Products & Services:

  • Timtronics
  • Thermal Interface Materials
  • Thermal Management Materials
  • Thermal Compounds
  • Thermal Pastes
  • Heat Sink Compounds
  • Silicone Heat Sink Compounds
  • Non Silicone Heat Sink Compounds
  • Thermal Grease
  • Conductive Greased
  • Non Silicon Compounds
  • Non Silicone Thermal Grease
  • Epoxy
  • Heat Sink Grease
  • Silicone Interface Materials
  • Interfaces Materials
  • Thermal Management Solutions
  • Grease Compounds
  • Thermally Conductive Compounds
  • Thermally Conductive Grease
  • Conductive Compounds
  • Conductive Grease
  • Electrically Conductive Compounds
  • Electrically Conductive Grease
  • High Temperature Conductive Grease
  • High Temperature Thermal Grease
  • Thermal Joint Compound
  • Filler Grease
  • Filler Compounds
  • Gap Filler
  • Insulator Grease
  • Carbon Grease
  • Cpu Grease
  • Non Curable Compounds
  • Silver Grease
  • Thermally Conductive Epoxy
  • Electrically Conductive Epoxy

Web Site Results

Silicone Heat Sink Compounds... Home|Thermal Greases & Epoxies|Thermal Gap Fillers & Pads|Applications/Packaging/Dispensing|Selection Guide|Contact Us White Ice Silicone Thermal... silicone compounds offer superior conductivity, low thermal resistance and long term stability. Typical Applications: CPU to Heat sink, Transistors, Diodes, IGBTs, Rectifiers, TEC... 2009-2010 Timtronics. All rights reserved. Designed By E-Design Non Silicone Silicone Food Grade Heat Sink Compound High Temperature Electrically Conductive Electrical Joint...
by Dispensing or Screen Printing/Stencil Typical Applications: White Ice 510FG Heat Sink Compound is applied to the any electronic devices for heat transfer which is located.... Designed By E-Design Non Silicone Silicone Food Grade Heat Sink Compound High Temperature Electrically Conductive Electrical Joint Compounds Epoxy/Potting Compounds Gap Filler...Food Grade Heat Sink... Home|Thermal Greases & Epoxies|Thermal Gap Fillers & Pads|Applications/Packaging/Dispensing|Selection Guide|Contact Us White Ice 510FGFood Grade Heat Sink...
. All rights reserved. Designed By E-Design Non Silicone Silicone Food Grade Heat Sink Compound High Temperature Electrically Conductive Electrical Joint Compounds Epoxy/Potting.... Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non... Silicone formulas with thermal conductivity up to 11 W/m K. Typical Application : Gap Fillers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures...
@timtronics.com All contents Copyrights 2009-2010 Timtronics. All rights reserved. Designed By E-Design Non Silicone Silicone Food Grade Heat Sink Compound High Temperature Electrically... components to heat sink. It forms soft elastomer in 15 minutes when expose to heat. TIM-LGF 2004: Two part, room temperature cure, simple 1:1 mix ratio for easy application. Forms... curing system. Form-in-place gap fillers are ideal for applying any thickness with little or no stress. Typical Appllication: LED bonding, PCBA to housing, discrete component to heat...
. Typical Application : Interface between a power transistor, CPU or other heat-generating components. Isolate electrical components and power sources from heat sink and/or mounting...: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. Excellent mechanical and physical characteristics with efficient heat dissipation...: (631) 775 - 4023 E-mail: info@timtronics.com All contents Copyrights 2009-2010 Timtronics. All rights reserved. Designed By E-Design Non Silicone Silicone Food Grade Heat Sink...
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