is a suggested list to help guide discussions. individual layer thickness and how you want to define that thickness required thickness uniformity (wafer to wafer, within wafer... with patterned wafers) wafer diameter pattern distortion and washout On the epi structure: Required thickness/composition uniformity Epi (poly) surface roughness requirement Ge...

.). Fast turnaround and high yields are standard. A majority of our high volume production is on 200 mm and 150 mm wafer diameters. We have 13 ASM Epsilon One 2000 reactors. Volume... production for typical buried layer epitaxy exceeds 700 wafers per week, per reactor The following are typical statistical process control charts on current production specifications. [Back] Copyright 2007 LSRL All rights reserved ...

Product 3 Home> EPI Services > SOI SIMOX SOI Summary data SIMOX SOI Thickness target and corresponding uniformity information for 100 mm, 150 mm and 200 mm diameter wafers The...

better than 4 % thickness uniformity within wafer and wafer to wafer. Composition within SIMS detection limits Minimal oxygen content is standard for all processes, < 1E18 cm-3...