including the assembly process requirements will be introduced. Specific packages to be discussed include Quad Flat Pack No Lead (QFN), Area Array Packages (BGAs, CSPs, Wafer Level CSPs....) Ball Grid Array (BGA) Packages Why are BGAs so popular? Manufacture of BGAs BGA Configurations 5.) Plastic BGAs Component Construction & Details Plastic BGA Benefits & Issues Self...-Centering of PBGAs 6.) Ceramic BGA (CBGA) Component Construction & Details Ceramic BGA Benefits & Issues 7.) Tape BGA (TBGA) Component Construction & Details Tape BGA Benefits...

International attendees. All Spotlight Sessions take place in the Exhibit Hall Theater. Spotlight 1 Polymeric Reinforcement of BGAs Chair: Raiyo Aspandiar, Ph.D., Intel Corporation Co... segments, BGA components on boards are being routinely underfilled or have glues applied to their corners. The motivation for this is to enhance the mechanical robustness... are critical for their successful use in the high volume manufacturing environment as well as to impart the necessary protection to the BGA components during the product use conditions...

-bumped die, SiP embedded die polyimide modules, and the solder joint integrity risks of extremely high I/O BGA connectors. Converting High Volume IC Manufacturing to Cu Wire... Embedded Die System in Package Modules John Aday, Theodore Tessier, David Hays, Flip Chip International; Kazuhisa Itoi, Fujukura High I/O BGA Connector Solder Joint Integrity..., Indium Corporation Co-Chair: Gregory K. Arslanian, Air Products and Chemicals, Inc. Tuesday, October 15 | 2:00pm - 3:30pm | Room 202D In very recent years, BGA, CSP and other...