Metallographic cross-sectioning is the technique, during material characterization or failure mode analysis, for exposing an internal plane of interest in an object or package for examination. Physically destructive in nature, cross-sectioning requires encapsulation of the specimen in plastic to pro...

Our engineering team has expertise with electro-optical components, other electronic active and passive electronic components, including ICs, power ICs, diodes, resistors, inductors and capacitors. Our engineering team is also highly experienced in analyzing and identifying failure modes in a variet...

With the elimination of lead (Pb) in electronic components in 2006 as a result of two European Union directives, 1) RoHS (Restriction on use of certain Hazardous Substances) and 2) WEEE (Waste from Electrical and Electronic Equipment), all manufacturers of ICs have been working the problems associat...

In an effort to provide a full-menu of testing services, Silicon Cert Laboratories offers a variety of tests in addition to mechanical integrity and endurance/environmental. Those highlighted below comprise a partial listing of our additional offerings. We are one of the few laboratories that will c...

Decapsulation is a chemical etching technique for opening IC plastic packages in order to expose their internal components for examination. Although physically destructive in nature, the process leaves the die, bond pads, and wire bonds intact. Several methods of decapsulation are available dependin...