-President, CODACO Inc. WHAT IF: you could pre-apply bonding material to your components, and then instantly activate the bond later, whenever you're ready? INTRODUCTION "The most... important advantage of the CODACO System is its bond-on-demand capability, which separates the application of the bonding material from the actual bonding process." The new CODACO High... substrates. The existing methods used to bond or seal these materials are generally either hot melt or cross linking glues which are difficult to apply or require extensive set-up...

| What's New? | Video Library | Contact Info | Privacy | Ambrell New: High-Speed Ink Jet Drying Technology - Learn More See the video... WHAT IF: you could pre-apply bonding material...-susceptible bonding material to your substrate offline. Store or re-position substrate as needed. STEP TWO: Use our activation equipment to instantly form a strong bond by passing your...CODACO On-Demand RF Bonding Systems For PE, PP, Paperboard An Ambrell Solutions Partner On-Demand RF Bonding Systems Home | Applications | Product Catalog | Company Profile...

could pre-apply bonding material to your components, and then instantly activate the bond later, whenever you're ready? INTRODUCTION "The most important advantage of the CODACO... System is its bond-on-demand capability, which separates the application of the bonding material from the actual bonding process." The new CODACO High Speed RF Bonding System... to bond or seal these materials are generally either water or solvent-based glues which require extensive set-up and dry time, or hot melts which have a limited amount of "open...

needs, will include three basic components: RF-susceptible bonding material, the activation equipment and the induction heating power supply which produces the RF field. The entire... to virtually any non-metallic material Can be formulated for application as a hot melt, aqueous spray, pattern print or co-extrusion For reversible adhesive or permanent fusion bonding... to activate adhesive material Probe is recessed into a pressure plate to precisely locate the substrate and bond line in RF field. DYNAMIC ACTIVATIONSYSTEM Designed for production...