microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled...

First Level Inc : capabilities capabilites Our current capabilities: Precision Component Placement Die Attach Wire Bonding Stud Bumping Die Shear / Ball SHear Testing... die bonding (silver filled epoxy, non conductive epoxy or epoxy pre-forms) Die shear and die pull test precision component placement Wire Bond Gold ball bonding (0.0007" to 0.0015... specifications or custom out lines Package Assembly Chip on board or chip on flex SCM and MCM Flip chip or wire bond interconnects Peripheral leads, BGA or CSP Design to JEDEC requirements...

affect the cash flow of the corporation. Cost of taxes, custom fees, bonded storage, custom brokerage fees, and other documents required for shipping overseas. Cost of money transfer... either by wire or through banks. Difficulty of communication due to different time zones and different languages: This could affect the implementation of an engineering change...