by alleviating interconnect delays with the use of scalable 3D routing. Ziptronix technologies are enabling the creation of true 3D integrated circuits (ICs) at the gate level... industry through our 3D integration technologies, and continually advance the way semiconductor products are designed and manufactured. Ziptronix technologies lower manufacturing.... Ziptronix Direct Bond Interconnect technology (DBI ) technology enables silicon to be architected and built in a 3D fashion to maximize the density of signal paths that chips use...