applications. ASC has both design and analysis electronic packaging experience. Design experience ranges through all aspects from Metal/Plastic/Composite Enclosures to Printed Wiring Board... (Rigid/Flex) fabrication/assembly (per IPC Standards) and System Interconnect/Cabling. Our analysis experience consists of performing Thermal (steady state and transient...) and Structural Analyses (modal, static, and dynamic). Capabilities ASC can perform any aspect of your electronic design; from front- end system design including specification generation...