applications, Quik-Pak utilizes the dice-before-backgrind process to singulate die before thinning down to as little as 50 m. Following wafer dicing, Quik-Pak can assemble your dice... services provided by Quik-Pak include: Wafer Backgrinding or Thinning Individual Die Thinning Die Sort or Pick & Place Inspection to MIL STD 883G Wafer Washing Home : Capabilities...Dicing of silicon wafers,... For optimal site interaction, please turn javascript on in your browser. For Netscape, go to Edit > Preferences > Advanced. For Internet Explorer, go...

: Wafer Backgrinding or Thinning Dicing of silicon, glass, quartz, laminate, ceramic and panels Dicing of Multi Project Wafers (MPW), pizza wafers and reticles Die Sort or Pick & Place... Inspection to MIL STD 883G Individual Die Thinning Wafer Washing Home : Capabilities & Services : Technical Information : News & Events : About Us : Contact Customer Service...WAFER PREPARATION For optimal site interaction, please turn javascript on in your browser. For Netscape, go to Edit > Preferences > Advanced. For Internet Explorer, go to Tools...

Services Custom OmPP lids Largest Selection of 0.40mm Pitch QFN's WAFER PREPARATION Wafer Backgrinding Singulated Die Thinning Dicing of silicon wafers, glass, laminates, panels Pick... Industries 858.674.4676 Customer Resource Center Request Quote / Sample / Info Contact Customer Service Home Capabilities & Services Quick Turn Prototypes Wafer Preparation Backgrinding... Articles Materials Information Tech Tips About Us Company Profile Contact Information Terms & Conditions WAFER PREPARATION PACKAGING SOLUTIONS IC CUSTOM ASSEMBLY Quick Links...