SEMPAC Inc. - Open-Pak Products Gallery - Ceramic Package Alternatives,... SEMPAC Inc. Innovative Solutions In Packaging Home Applications Products New Solutions News Company... developed Plastic Lid which will further enhance our existing line of ceramic and gla ... Home- Applications- Products- New Solutions- News- Company- Careers- Contact 2013 SEMPAC Inc. ...

SEMPAC Inc. - Open-Pak QFN, Ceramic Package Alternatives, Prototype... SEMPAC Inc. Innovative Solutions In Packaging Home Applications Products New Solutions News Company Careers... Body Thickness JEDEC Spec 3X3 mm 8 1.36x2.20 mm 0.65 mm 0.75 mm MO-229 Package Drawing DFN3X3-08-OP-01 Bonding Drawing DFN3X3-08-OP-01-B Ceramic Lid Part No.CL-MLP3X3-15-01Request... Quote 3X3 mm 10 1.36x2.20 mm 0.50 mm 0.75 mm MO-229 Package Drawing DFN3X3-10-OP-01 Bonding Drawing DFN3X3-10-OP-01-B Ceramic Lid Part No.CL-MLP3X3-15-01Request Quote 3X3 mm 12 1.36...

SEMPAC Inc. - Open-Pak QFP, Ceramic Package Alternatives, Prototype... SEMPAC Inc. Innovative Solutions In Packaging Home Applications Products New Solutions News Company Careers...-44-OP-01 Bonding Drawing LQFP10X10-44-OP-01-B Ceramic Lid Part No.CL-LQFP10X10-15-01Request Quote 10X10 mm 52 6.86 SQ mm 0.65 mm 1.14 mm MS-026 Package Drawing LQFP10X10-52-OP-01... Bonding Drawing LQFP10X10-52-OP-01-B Ceramic Lid Part No.CL-LQFP10X10-15-01Request Quote 10X10 mm 64 6.86 SQ mm 0.50 mm 1.14 mm MS-026 Package Drawing LQFP10X10-64-OP-01 Bonding...

SEMPAC Inc. - Open-Pak SOIC, SSOP, Ceramic Package Alternatives,... SEMPAC Inc. Innovative Solutions In Packaging Home Applications Products New Solutions News Company Careers.... These packages also come with their matching ceramic or glass epoxy coated or non-coated lids. SEMPAC s Open-Pak SOIC s & SSOP s are also available in the Nickel Palladium (Ni/Pd... Die Pad Size Lead Pitch Body Thickness JEDEC Spec .150 in. 8 .075X.100 in. 0.050 in. 0.055 in. MS-012 Package Drawing SOIC150-08-OP-01 Bonding Drawing SOIC150-08-OP-01-B Ceramic Lid...

agreement with Sempac that will enable the company to offer a low-cost alternative to ceramic packages for VLSI circuits The deal will give customers who use the Mosis multi-project... wafer (MPW) service access to QFN/MLP, QFP and SOIC/SSP packages from Sempac's Open-Pak product line. These pre-molded, air cavity packages meet the latest JEDEC outline... and footprint standards. This means that devices can be designed for high volume production with streamlined testing to further reduce costs. Open-Pak packages are made from semiconductor...