growth or deposition. The absence of leveler in the valleys will allow faster deposit growth and allow the valleys to catch up to the peak, thus creating leveling. Pulse Plating: For... the last few years the copper plating industry was focused on pulse plating and in particular periodic pulse reverse, as the solution for all. As time progressed and the level... of difficulty continued to climb, the plating current density for pulse began to drop and the primary advantage of plating at higher current density began to disappear. Add...

PCBs and chip packages. Pulse and DC plating via fill chemistries many with new electrolytes offer a series of advantages, as they do not require pulse rectification and avoid... the complexity of managing a pulse wave. In addition, DC plating systems are stable and do not require constant regeneration of electrolytes used with pulse rectification. Via filling...Innovative Solutions... UYEMURA LIBRARY HOME / ABOUT US / CONTACT Story #1: New Developments in DC Acid Copper for Vertical Plating Tanks Story #2: Surface Finishes in a Lead Free...