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Norcross, Georgia
engent is a provider of next generation electronic manufacturing, packaging & technology services. we help our clients realize products that require small ...

Colorado Springs, Colorado
aspen, aspen technologies

Saint Albans, Vermont
open cavity san diego, wire bond, wedge bond, gold bond, aluminum bond, transfer mold, integrated circuit package, ic package, semiconductor assembly, ...

Endicott, New York
tape and reel, axial components, radial components, surface mount, odd-form, jumper wires, ammo pack, bandoliering, custom wire forming, component packaging, lead ...


Piscataway, New Jersey
mocvd, oxide, ferroelectric, tco, sbt, pzt, dram, gmr, mram, zno


Portland, Oregon
process automation, turnkey, semiconductor processing, equipment, wafer process, design, custom, clean room, dwfritz, automation control

Milpitas, California
prototype assembly, ceramic packages, bga, wafer, mil-spec, plastic assembly, ic assembly, method 5004/5005, iso-9002, dscc suitability letter, qml listed, ...


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